Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-06-28
2011-06-28
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257SE23024, C257S786000, C257S686000, C257S777000, C257S723000, C257S734000, C257S789000, C257S790000, C257SE27137, C257SE23021
Reexamination Certificate
active
07969023
ABSTRACT:
An integrated circuit package in package system includes: providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires; mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film; and encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
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“McGraw-Hill dictionary of Scientific and Technical Terms, Sixth Edition”, Sep. 26, 2002, p. 798 Publisher: McGraw-Hill, Published in: New York.
Han Byung Joon
Lim Taeg Ki
Yun JaEun
Ishimaru Mikio
Stats Chippac Ltd.
Williams Alexander O
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