4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Sung-Gue Lee

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Bonding pads for a printed circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Chip mounting structure having adhesive conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Method for fabricating circuit pattern of printed circuit board

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Method for forming bonding pads

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method for forming bonding pads

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2412132

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