Method for forming bonding pads

Details Method for forming bonding pads Method for forming bonding pads

2007-08-21

2007-08-21

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S843000, C029S874000, C174S257000, C361S763000, C438S612000

Reexamination Certificate

active

10836219

ABSTRACT:
A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns such that an upper surface of the copper pattern is exposed. A plating layer is then applied to the exposed upper surface of the copper patterns. Protrusion of the plating layer at a lower portion of a copper pattern is prevented, thus reducing an interval between the wire bonding pad(s) and potentially increasing the number of bonding pads which may be effectively formed on a given PCB.

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Japanese Office Action dated Oct. 26, 2004.

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