Bonding pads for a printed circuit board

Details Bonding pads for a printed circuit board Bonding pads for a printed circuit board

2007-12-04

2007-12-04

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000

Reexamination Certificate

active

10837701

ABSTRACT:
Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.

REFERENCES:
patent: 3881884 (1975-05-01), Cook et al.
patent: 4081601 (1978-03-01), Dinella et al.
patent: 4109297 (1978-08-01), Lesh et al.
patent: 4289575 (1981-09-01), Matsumoto et al.
patent: 4910094 (1990-03-01), Watanabe et al.
patent: 5118386 (1992-06-01), Kataoka et al.
patent: 5169680 (1992-12-01), Ting et al.
patent: 5733466 (1998-03-01), Benebo et al.
patent: 6015482 (2000-01-01), Stern
patent: 6041495 (2000-03-01), Yoon et al.
patent: 6045713 (2000-04-01), Tamiya et al.
patent: 6162365 (2000-12-01), Bhatt et al.
patent: 6210746 (2001-04-01), Cheng
patent: 6249053 (2001-06-01), Nakata et al.
patent: 6333252 (2001-12-01), Jung et al.
patent: 6334942 (2002-01-01), Haba et al.
patent: 6398935 (2002-06-01), Downes
patent: 6517893 (2003-02-01), Abys et al.
patent: 6717059 (2004-04-01), Shintani et al.
patent: 6717069 (2004-04-01), Yoneda
patent: 6809415 (2004-10-01), Tsukada et al.
patent: 05-183259 (1993-07-01), None
patent: 10-012999 (1998-01-01), None
patent: 11-307678 (1999-11-01), None
Computer translation of Japanese Patent No. 05-183259 to Nobuhito Hayashi.

Affiliated with

Also associated with

Rating

Bonding pads for a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding pads for a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding pads for a printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3827646