Method for fabricating circuit pattern of printed circuit board

Details Method for fabricating circuit pattern of printed circuit board Method for fabricating circuit pattern of printed circuit board

2005-02-01

2005-02-01

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098200, C427S099200, C427S099300

Reexamination Certificate

active

06849294

ABSTRACT:
A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface of the resin layer-removed portion of the insulation material to form circuit patterns and a connection pad; and a fourth step of forming a gold plated layer on the connection pad. By doing that, a fine circuit pattern can be easily formed.

REFERENCES:
patent: 5705430 (1998-01-01), Avanzino et al.
patent: 6579785 (2003-06-01), Toyoda et al.
patent: 20010023532 (2001-09-01), Fujii et al.

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