Lead frame and semiconductor package

Details Lead frame and semiconductor package Lead frame and semiconductor package

1997-01-17

1999-04-27

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257672, 257787, H01L 23495

Patent

active

058982124

ABSTRACT:
A lead frame includes a first lead and a second lead formed on the first lead. The second lead may comprise a conductive adhesive and a conductive layer attached to the first lead. Such leads may be used for a package where the second leads are exposed on the outside exterior of a molded resin and/or a semiconductor chip has a plurality of center chip pads.

REFERENCES:
patent: 3902148 (1975-08-01), Drees et al.
patent: 5461255 (1995-10-01), Chan et al.

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