Fabrication method for semiconductor package substrate and semic

Details Fabrication method for semiconductor package substrate and semic Fabrication method for semiconductor package substrate and semic

1998-02-20

1999-10-05

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438106, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

059637960

ABSTRACT:
A fabrication method for a chip package includes the steps of forming a first substrate having embedded leads, forming a second substrate with embedded leads and a central aperture therethrough, and attaching the second substrate to the first substrate to form a substrate with a recess for receiving a chip. A chip may then be mounted within the central aperture of the second substrate, on the first substrate, and bond pads of the chip may be attached to leads exposed on one of the first and second substrates with a plurality of metal wires. A resin may be molded over the device to protect the metal wires, the chip, and the leads.

REFERENCES:
patent: 3290564 (1966-12-01), Wolff
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4420767 (1983-12-01), Hodge et al.
patent: 4975761 (1990-12-01), Chu
patent: 5012386 (1991-04-01), McShane et al.
patent: 5339518 (1994-08-01), Tran et al.
patent: 5455384 (1995-10-01), Ichihara
patent: 5471011 (1995-11-01), Maslakow
patent: 5490324 (1996-02-01), Newman
patent: 5523622 (1996-06-01), Harada et al.
patent: 5536362 (1996-07-01), Love et al.
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5600101 (1997-02-01), Sakai
patent: 5604328 (1997-02-01), Kubota et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5756377 (1998-05-01), Ohsawa

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