4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Son K. Tran

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Encapsulated chip module and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Encapsulation of solder bumps and solder connections

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Extension of fatigue life for C4 solder ball to chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Extension of fatigue life for C4 solder ball to chip connection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Flip chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1271395

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