Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-06-27
2006-06-27
Smith, Matthew (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Reexamination Certificate
active
07067916
ABSTRACT:
A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.
REFERENCES:
patent: 5075965 (1991-12-01), Carey et al.
patent: 5567655 (1996-10-01), Rostoker et al.
patent: 5808853 (1998-09-01), Dalal et al.
patent: 5889326 (1999-03-01), Tanaka
patent: 5977632 (1999-11-01), Beddingfield
patent: 6016011 (2000-01-01), Cao et al.
patent: 6072242 (2000-06-01), Son
patent: 6084312 (2000-07-01), Lee
patent: 6088236 (2000-07-01), Tomura et al.
patent: 6143639 (2000-11-01), Medlen et al.
patent: 6153938 (2000-11-01), Kanda et al.
patent: 6166556 (2000-12-01), Wang et al.
patent: 6310403 (2001-10-01), Zhang et al.
patent: 6320254 (2001-11-01), Liou et al.
patent: 6342399 (2002-01-01), Degani
patent: 6399178 (2002-06-01), Chung
patent: 6592019 (2003-07-01), Tung
patent: 2000306951 (2001-03-01), None
patent: 64002338 (2002-10-01), None
Bernier William E.
Carey Charles F.
Gramatzki Eberhard B.
Homa Thomas R.
Johnson Eric A.
Schmeiser Olsen & Watts
Smith Matthew
Steinberg William H.
LandOfFree
Extension of fatigue life for C4 solder ball to chip connection does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Extension of fatigue life for C4 solder ball to chip connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Extension of fatigue life for C4 solder ball to chip connection will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3619228