Encapsulation of solder bumps and solder connections

Details Encapsulation of solder bumps and solder connections Encapsulation of solder bumps and solder connections

1998-08-10

2000-08-08

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438106, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

061001147

ABSTRACT:
Solder bumps on electronic components are encapsulated before attachment to a substrate or component carrier. A film of sealing material is pressed against top portions of the solder bumps by pressing with a layer of low durometer flexible material. Encapsulant is positioned between the component and the film and in contact with the bumps, and partially cured. The film and layer of flexible material are removed to expose the top portions of the encapsulated solder bumps.

REFERENCES:
patent: 5363277 (1994-11-01), Tanaka
patent: 5661088 (1997-08-01), Tessier et al.
patent: 5663106 (1997-09-01), Karavakis et al.
patent: 5704116 (1998-01-01), Gamota et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 5776796 (1998-07-01), Distefano et al.
L. P. McGovern et al. "High-Throughput, Low-Cost Flip Chip-On-Board Assembly" Electronic Packaging & Production, Feb. 1998, pp. 68-76.
D. Gamota & C. Melton, "Materials to Integrate the Solder Reflow and . . . " IEEE Trans. on CPMT, Part C, vol. 21, No. 1, Jan. 1998, pp. 57-65.
"A High Speed Underfill Development for Flip Chips," SMT MAgazine, Feb. 1998, pp. 46 and 48.

Affiliated with

Also associated with

Rating

Encapsulation of solder bumps and solder connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation of solder bumps and solder connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation of solder bumps and solder connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1149348