4. Plastic and nonmetallic article shaping or treating: processes
  5. Mechanical shaping or molding to form or reform shaped article
  6. To produce composite, plural part or multilayered article

Siliconware Precision Industries Co., LTD.

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Ball grid array package with conductive leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Carrier-free semiconductor package and fabrication method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chip packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Chip-stacked semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Circuit board structure and method for fabricating the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-1284174

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