Carrier-free semiconductor package and fabrication method...

Details Carrier-free semiconductor package and fabrication method... Carrier-free semiconductor package and fabrication method...

2008-01-01

2008-01-01

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C438S123000, C257S784000, C257S787000, C257SE23031, C257SE23061, C257S676000

Reexamination Certificate

active

07314820

ABSTRACT:
A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.

REFERENCES:
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5830800 (1998-11-01), Lin
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6770959 (2004-08-01), Huang et al.
patent: 6777265 (2004-08-01), Islam et al.
patent: 6955942 (2005-10-01), Kobayashi et al.
patent: 6955949 (2005-10-01), Batish et al.
patent: 7052492 (2006-05-01), Swanson et al.
patent: 7125747 (2006-10-01), Lee et al.

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