Circuit board structure and method for fabricating the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C361S760000

Reexamination Certificate

active

07999189

ABSTRACT:
A circuit board structure and a method for fabricating the same are disclosed, including providing a core board having conductive traces and solder pads respectively formed thereon, wherein width of the solder pads corresponds to that of the conductive traces, and pitch between adjacent solder pads is made wide enough to allow multiple conductive traces to pass through; forming on the core board an insulating layer with openings for exposing the solder pads therefrom; forming on the insulating layer a plurality of extending pads electrically connected to the solder pads respectively, wherein the projection area of the extending pads is larger than that of the corresponding solder pads and covers conductive traces adjacent to the corresponding solder pads. Thus, more conductive traces are allowed to pass between adjacent solder pads and meanwhile, the extending pads provide an effective solder ball wetting area for achieving good solder joints and sufficient height after collapse.

REFERENCES:
patent: 5706178 (1998-01-01), Barrow
patent: 6396707 (2002-05-01), Huang et al.
patent: 6543128 (2003-04-01), Huang et al.
patent: 6559540 (2003-05-01), Kawashima
patent: 6884652 (2005-04-01), Huang et al.
patent: 7145225 (2006-12-01), Lee
patent: 7227263 (2007-06-01), Yamaguchi
patent: 7816187 (2010-10-01), Huang et al.

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