4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With dam or vent for encapsulant

Shinji Ohuchi

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active

Bond pad for stress releif between a substrate and an...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Manufacturing method of stack-type semiconductor device

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Manufacturing method of stack-type semiconductor device

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Method for fabricating resin-molded semiconductor device...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of fabricating a semiconductor device having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-652338

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