Manufacturing method of stack-type semiconductor device

Details Manufacturing method of stack-type semiconductor device Manufacturing method of stack-type semiconductor device

2008-07-29

2008-07-29

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S033000, C438S068000, C438S113000, C257S528000, C257S618000, C257S622000

Reexamination Certificate

active

11235354

ABSTRACT:
A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part if wiring104is formed al so at the side surface of a semiconducter element101, and bump electrodes102formed so as to be nearly on a same plane as the wiring104formed at the side surface of the semiconducter element101, at least a part of ball electrodes103is formed so as to connect electrically to the wiring104at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring104, and the confronting surface of the circuit forming surface is sealed with resin.

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