Manufacturing method of stack-type semiconductor device

Details Manufacturing method of stack-type semiconductor device Manufacturing method of stack-type semiconductor device

2008-07-29

2008-07-29

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S033000, C438S068000, C438S113000, C257S528000, C257S618000, C257S622000

Reexamination Certificate

active

07405138

ABSTRACT:
A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part if wiring104is formed al so at the side surface of a semiconducter element101, and bump electrodes102formed so as to be nearly on a same plane as the wiring104formed at the side surface of the semiconducter element101, at least a part of ball electrodes103is formed so as to connect electrically to the wiring104at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring104, and the confronting surface of the circuit forming surface is sealed with resin.

REFERENCES:
patent: 5281852 (1994-01-01), Normington
patent: 5313096 (1994-05-01), Eide
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5508562 (1996-04-01), Horie et al.
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5895970 (1999-04-01), Miyoshi
patent: 5903049 (1999-05-01), Mori
patent: 5986209 (1999-11-01), Tandy
patent: 5994772 (1999-11-01), Shin
patent: 5995379 (1999-11-01), Kyougoku et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6028358 (2000-02-01), Suzuki
patent: 6028365 (2000-02-01), Akram et al.
patent: RE36613 (2000-03-01), Ball
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6104088 (2000-08-01), Hatano et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6303872 (2001-10-01), Jairazbhoy et al.
patent: 6303997 (2001-10-01), Lee
patent: 6339255 (2002-01-01), Shin
patent: 6376769 (2002-04-01), Chung
patent: 6379999 (2002-04-01), Tanabe
patent: 6410406 (2002-06-01), Farnworth et al.
patent: 6486544 (2002-11-01), Hasimoto
patent: 6501663 (2002-12-01), Pan
patent: 6562647 (2003-05-01), Zandman et al.
patent: 6576971 (2003-06-01), Kimoto et al.
patent: 2001/0000053 (2001-03-01), Suh et al.
patent: 2001/0048151 (2001-12-01), Chun
patent: 2002/0089043 (2002-07-01), Park et al.
patent: 2002/0190396 (2002-12-01), Brand
patent: 10-261753 (1998-08-01), None

Affiliated with

Also associated with

Rating

Manufacturing method of stack-type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of stack-type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of stack-type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2751822