Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
Inventor
active
Molded leadless package having a partially exposed lead...
Molded leadless package having a partially exposed lead...
Power device having multi-chip package structure
Semiconductor package structures using epoxy molding compound pa
Semiconductor package suitable for high voltage applications
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Profile ID: LFUS-PAI-P-877021