Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-01-01
2008-01-01
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S787000, C257SE23051, C257SE23092
Reexamination Certificate
active
07315077
ABSTRACT:
Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the first surface of the lead frame pad. A lead is electrically coupled to the semiconductor chip. A molding material covers the lead frame pad, the semiconductor chip, and the lead and exposes a portion of the lead and a portion of the second surface of the lead frame pad. A step difference is formed between a surface of the molding material covering the second surface of the lead frame pad and the second surface of the lead frame pad itself. The sawing type molded leadless package includes a short-circuit preventing member that is post-shaped or convex, and protruding from the lower surface of the die pad.
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Choi Yoon-hwa
Estacio Maria Cristina B.
Jeon O-seob
Joshi Rajeev Dinkar
Nam Shi-baek
Fairchild Korea Semiconductor Ltd.
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
Huynh Andy
LandOfFree
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