Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1998-06-05
2000-02-15
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257728, 257781, 257782, 257784, 257777, 257778, 257723, 257669, H01L 2334, H01L 2329, H01L 23495
Patent
active
060256516
ABSTRACT:
A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predetermined number of EMC tablets. The EMC pad pattern is molded by heating and pressing the EMC tablets into a wafer shape having a thickness of approximately 0.3 mm and a diameter of approximately 100 mm. Such a thin EMC pad is capable of providing sufficient dielectric strength, and allows for manufacturing of semiconductor packages at lower cost. In addition, conventional equipment can be used to fabricate the semiconductor packages. The packages are flexible, and even a thin package is not easily broken.
REFERENCES:
patent: 5614860 (1997-03-01), Osaki et al.
patent: 5786271 (1998-07-01), Ohida et al.
patent: 5790377 (1998-08-01), Schreiber et al.
Saadat Mahshid
Samsung Electronics Co,. Ltd.
Warren Matthew E.
LandOfFree
Semiconductor package structures using epoxy molding compound pa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package structures using epoxy molding compound pa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package structures using epoxy molding compound pa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1908120