4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Shau-Lin Shue

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3D reservoir to improve electromigration resistance of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion of copper and etch stop layer for copper alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Adhesion of copper and etch stop layer for copper alloy

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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AlCu electromigration (EM) resistance

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Barrier layer and fabrication method thereof

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-697020

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