4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Ruben Madrid

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Carrier with metal bumps for semiconductor die packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Carrier with metal bumps for semiconductor die packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Dual side cooling integrated power device package and module...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Method for making power chip scale package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Power chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2667319

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