Carrier with metal bumps for semiconductor die packages

Details Carrier with metal bumps for semiconductor die packages Carrier with metal bumps for semiconductor die packages

2005-05-17

2005-05-17

Wojciechowicz, Edward (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S666000, C438S673000

Reexamination Certificate

active

06893901

ABSTRACT:
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.

REFERENCES:
patent: 5892271 (1999-04-01), Takeda et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6144101 (2000-11-01), Akram
patent: 20020050912 (2002-05-01), Shrier et al.
patent: 20020074147 (2002-06-01), Tan et al.

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