Carrier with metal bumps for semiconductor die packages

Details Carrier with metal bumps for semiconductor die packages Carrier with metal bumps for semiconductor die packages

2006-04-04

2006-04-04

Wojciechowicz, Edward (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S679000, C257S680000

Reexamination Certificate

active

07023077

ABSTRACT:
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.

REFERENCES:
patent: 5123163 (1992-06-01), Ishikawa et al.
patent: 5892271 (1999-04-01), Takeda et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6144101 (2000-11-01), Akram
patent: 6489204 (2002-12-01), Tsui
patent: 2002/0050912 (2002-05-01), Shrier et al.
patent: 2002/0074147 (2002-06-01), Tan et al.
patent: 978871 (2000-02-01), None

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