4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...

Ronald L. Mendelson

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Copper pad structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Mechanical strength die sorting

Classifying – separating – and assorting solids – Sorting special items – and certain methods and apparatus for... – Condition responsive means controls separating means
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Method and system for dicing wafers, and semiconductor...

Stone working – Sawing – Rotary
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Method and system for dicing wafers, and semiconductor...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Method for mounting wafer frame at back side grinding (BSG) tool

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
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Profile ID: LFUS-PAI-P-1638895

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