Method for mounting wafer frame at back side grinding (BSG) tool

Details Method for mounting wafer frame at back side grinding (BSG) tool Method for mounting wafer frame at back side grinding (BSG) tool

1999-03-04

2000-11-28

Niebling, John F.

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

438759, H01L 2131, H01L 21469

Patent

active

061535362

ABSTRACT:
A method for manufacturing a low profile semiconductor chip, includes fabricating a semiconductor device on a semiconductor wafer, grinding, with a grinding tool, a backside of the semiconductor wafer to reduce a thickness thereof, and with the wafer in the grinding tool, providing a support structure on the ground backside of the wafer.

REFERENCES:
patent: 5087585 (1992-02-01), Hayashi
patent: 5268065 (1993-12-01), Grupen-shemansky
patent: 5389182 (1995-02-01), Mignardi
patent: 5411921 (1995-05-01), Negoro
patent: 5457072 (1995-10-01), Tamaki et al.
patent: 5632667 (1997-05-01), Earl et al.
patent: 5637395 (1997-06-01), Uemura et al.
patent: 5731243 (1998-03-01), Peng et al.
patent: 5773362 (1998-06-01), Tonti et al.
patent: 5986338 (1999-11-01), Nakajima

Affiliated with

Also associated with

Rating

Method for mounting wafer frame at back side grinding (BSG) tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting wafer frame at back side grinding (BSG) tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting wafer frame at back side grinding (BSG) tool will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1725581