Method and system for dicing wafers, and semiconductor...

Details Method and system for dicing wafers, and semiconductor... Method and system for dicing wafers, and semiconductor...

2005-07-12

2005-07-12

Hail, III, Joseph J. (Department: 3723)

Stone working

Sawing

Rotary

C125S012000, C125S013010, C125S014000, C125S015000, C125S020000, C451S006000, C451S008000, C451S009000, C451S010000

Reexamination Certificate

active

06915795

ABSTRACT:
A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

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