4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Romel N. Manatad

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Alternative flip chip in leaded molded package design and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flip chip in leaded molded package and method of manufacture...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2227767

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