Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-15
2007-05-15
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S116000, C438S123000, C438S124000, C257SE23128
Reexamination Certificate
active
10772064
ABSTRACT:
A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the leadframe structure, and comprises a window. A semiconductor die comprising an edge is mounted on the die attach region and is within the window. A gap is present between the edge of the semiconductor die and the molding material.
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Brewster William M.
Fairchild Semiconductor Corporation
Townsend and Townsend / and Crew LLP
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