Flip chip in leaded molded package and method of manufacture...

Details Flip chip in leaded molded package and method of manufacture... Flip chip in leaded molded package and method of manufacture...

2005-09-27

2005-09-27

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C138S112000, C138S116000, C138S123000, C138S124000

Reexamination Certificate

active

06949410

ABSTRACT:
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.

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