Robert E. Braun

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Hermetic integrated circuit package for high density high power

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Hermetic single chip integrated circuit package

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Hold down device for use in electronic systems employing integra

Geometrical instruments
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Integrated circuit package connector with probing facility

Geometrical instruments
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Island assembly employing cooling means for high density integra

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Profile ID: LFUS-PAI-P-846501

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