Hermetic integrated circuit package for high density high power

Details Hermetic integrated circuit package for high density high power Hermetic integrated circuit package for high density high power

1980-02-04

1982-07-06

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 357 81, 174 52FP, H01L 2302, H01L 2312, H01L 3902

Patent

active

043386210

ABSTRACT:
The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.

REFERENCES:
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3502786 (1970-03-01), Stoll
patent: 3504096 (1970-03-01), Nagel
patent: 3872583 (1975-03-01), Beall et al.
patent: 4004195 (1977-01-01), Harayda et al.
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4285002 (1981-08-01), Campbell

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