Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1980-02-04
1982-07-06
James, Andrew J.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 80, 357 81, 174 52FP, H01L 2302, H01L 2312, H01L 3902
Patent
active
043386210
ABSTRACT:
The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.
REFERENCES:
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3502786 (1970-03-01), Stoll
patent: 3504096 (1970-03-01), Nagel
patent: 3872583 (1975-03-01), Beall et al.
patent: 4004195 (1977-01-01), Harayda et al.
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4285002 (1981-08-01), Campbell
Burroughs Corporation
Chung E. M.
James Andrew J.
Peterson K. R.
Varallo F. A.
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