Hermetic single chip integrated circuit package

Details Hermetic single chip integrated circuit package Hermetic single chip integrated circuit package

1990-02-20

1991-07-09

Jackson, Jr., Jerome

357 75, 357 81, 357 80, H01L 2304, H01L 2302

Patent

active

050310259

ABSTRACT:
An individual integrated circuit package utilizing an intermediate die carrier having legs in contact with a wiring substrate and a compatible lid to effect hermeticity. More specifically, the carrier includes on its outer surface a raised section and a peripheral ledge. The cap is formed with a cutout in its closed extremity to accommodate the raised carrier section and the portions of the cap adjacent the cutout rest upon and are sealed to the carrier ledge. The rim of the cap at its open extremity contacts and is sealed to the substrate to form the completed hermetic package.

REFERENCES:
patent: 3312771 (1967-04-01), Hessinger et al.
patent: 4278991 (1981-07-01), Ritchie et al.
patent: 4285002 (1981-08-01), Campbell
patent: 4748538 (1988-05-01), Tsuji
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4905075 (1990-02-01), Temple et al.
patent: 4922324 (1990-05-01), Sudo et al.
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4943844 (1990-07-01), Oscilowski et al.

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