Hold down device for use in electronic systems employing integra

Geometrical instruments

Patent

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Details

339 75MP, 339 91R, 339112R, 339119R, H01K 112

Patent

active

039428540

ABSTRACT:
A hold down device is described for applying a high clamping force to a "leadless" integrated circuit package installed in a suitable connector. Use of the device results in reliable electrical connections between the package circuit leads and the connector contact elements; and reliable thermal connections between the package carrier and a cooling frame provided to dissipate the heat generated by the integrated circuits. The hold down device has added system utility in the clamping of an interconnect cable assembly adapted to plug into the aforementioned connector in lieu of the integrated circuit package.

REFERENCES:
patent: 2549725 (1951-04-01), Uline et al.
patent: 2650948 (1953-09-01), Findlay
patent: 3335327 (1967-08-01), Damon et al.
patent: 3753211 (1973-08-01), Pauza et al.
patent: 3771109 (1973-11-01), Bruckner et al.

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