Integrated circuit package connector with probing facility

Details Integrated circuit package connector with probing facility Integrated circuit package connector with probing facility

1974-10-09

1976-05-11

McGlynn, Joseph H.

Geometrical instruments

H01K 112

Patent

active

039558673

ABSTRACT:
A connector or receptacle is described for connecting a leadless integrated circuit package to an interconnection medium such as a printed circuit board without the need for soldering connections. A significant feature of the connector is that all of its electrical contacts may be engaged or probed individually or collectively from the package side of the interconnection board for diagnostic and test purposes. Probe means suitable for use with the connector are also described.

REFERENCES:
patent: 3754203 (1973-08-01), Pauza et al.
patent: 3761808 (1973-09-01), Ryan
patent: 3805212 (1974-04-01), Landman et al.
patent: 3877064 (1975-04-01), Scheingold et al.
D. W. Ormond; "High-Temperature Multicontact Probe;" IBM Technical Disclosure Bulletin; Vol. 14, No. 2, July 1971, p. 568.

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