Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1974-10-09
1976-03-23
Tolin, Gerald P.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 79, 174 15R, H01L 2324
Patent
active
039462765
ABSTRACT:
A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.
REFERENCES:
patent: 3320488 (1967-05-01), Karew et al.
patent: 3611562 (1971-10-01), Herb
patent: 3662225 (1972-05-01), Carter
patent: 3731254 (1973-05-01), Key
patent: 3755719 (1973-08-01), Wilcox
patent: 3794886 (1974-02-01), Goldman
Microcircuit Module and Connector, Franck and Hill, IBM Tech. Discl. Bull., Vol. 13, No. 7, Dec. 1970, pp. 1786.
Dual In-Line Package for Integrated Circuits, Horn, Western Electric, Technical Digest No. 27, July 1972, p. 19.
Braun Robert E.
Jones Richard H.
Sprenkle George J.
Stopper Herbert
Burroughs Corporation
Feeney, Jr. Edward J.
Peterson Kevin R.
Tolin Gerald P.
Varallo Francis A.
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