4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Regenerative type switching device
  6. Bidirectional rectifier with control electrode

Richard J. Rassel

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Bond pad for wafer and package for CMOS imager

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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CMOS imager with Cu wiring and method of eliminating high...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Delamination and crack resistant image sensor structures and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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High efficiency CMOS image sensor pixel employing dynamic...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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High surface area aluminum bond pad for through-wafer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2242324

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