Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2011-06-21
2011-06-21
Stark, Jarrett J (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C438S612000, C438S622000, C257SE23160
Reexamination Certificate
active
07964967
ABSTRACT:
A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.
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Adkisson James W.
Gambino Jeffrey P.
Jaffe Mark D.
Rassel Richard J.
Sprogis Edmund J.
International Business Machines - Corporation
Scully , Scott, Murphy & Presser, P.C.
Stark Jarrett J
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