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                    Randy C. Long 
                        Randy C.
                        
                        Long
                
            
            
                    
                    Alloys or metallic compositions
 
                     
                    Containing over 50 per cent metal but no base metal
 
                    
                    Copper containing
 
            
            
            
                
            
            
                
            
            
            
            
                    
                    Inventor
 
                    
                    active
 
            
            
            
                
            
            
                
            
            
            
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                High temperature, lead-free, tin based solder composition
            
                Alloys or metallic compositions – Tin base – Copper containing
            Patent
         
            
            
                
    
    
            
            
            
            
            
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                Lead free, tin-bismuth solder alloys
            
                Alloys or metallic compositions – Containing over 50 per cent metal but no base metal – Copper containing
            Patent
         
            
            
                
    
    
            
            
            
            
            
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                Lead-free, high temperature, tin based multi-component solder
            
                Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
            Patent
         
            
            
                
    
    
            
            
            
            
            
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                Lead-free, high tin, ternary solder alloy of tin, bismuth, and i
            
                Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
            Patent
         
            
            
                
    
    
            
            
            
            
            
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                Lead-free, high tin, ternary solder alloy of tin, bismuth, and i
            
                Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
            Patent
         
            
            
                
    
    
            
            
            
            
            
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                Profile ID: LFUS-PAI-P-161980
            
         
                        
 
                        
    
    
        
                
                
                
                
                
        
                     
                    
                    
                        
                        
                        
                        
                        
                        
                        
                        
                        
                        
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