Lead-free, high temperature, tin based multi-component solder

Details Lead-free, high temperature, tin based multi-component solder Lead-free, high temperature, tin based multi-component solder

1993-06-16

1994-07-12

Dean, R.

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420559, 420561, 148400, C22C 1300

Patent

active

053286600

ABSTRACT:
Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.

REFERENCES:
patent: 3607253 (1971-09-01), Cain
patent: 4643875 (1987-02-01), Mizuhara
patent: 4667871 (1987-05-01), Mizuhara
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 4806309 (1989-02-01), Tulman
patent: 4929423 (1990-05-01), Tucker et al.
McCormack, Mark et al., "Progress in the Design of New Lead Free Solder Alloys," JOM vol. 45, No. 7, pp. 36-40, Jul. 1993.
Journal Environmental Science, A26(6), 911-929 (1991) K. S. Subramanian et al "Leaching of Antimony, Cadmium, Copper Lead, Silver, Tin And Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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