Lead free, tin-bismuth solder alloys

Details Lead free, tin-bismuth solder alloys Lead free, tin-bismuth solder alloys

1993-06-16

1994-11-29

Dean, Richard O.

Alloys or metallic compositions

Containing over 50 per cent metal but no base metal

Copper containing

420577, C22C 3002

Patent

active

053688147

ABSTRACT:
The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.

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Journal Environmental Science, A26(6), 911-929 (1991) K. S. Subramanian et al "Leaching Of Antimony, Cadmium, Copper Lead, Silver, Tin and Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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