Lead free, tin-bismuth solder alloys

Alloys or metallic compositions – Containing over 50 per cent metal but no base metal – Copper containing

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420577, C22C 3002

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active

053688147

ABSTRACT:
The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.

REFERENCES:
patent: 3607253 (1971-09-01), Cain
patent: 4083718 (1978-04-01), Murabayashi et al.
patent: 4236922 (1980-12-01), Michl et al.
patent: 4643875 (1987-02-01), Mizuhara
patent: 4667871 (1987-05-01), Mizuhara
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 4806309 (1989-02-01), Tulman
patent: 4929423 (1990-05-01), Tucker et al.
Journal Environmental Science, A26(6), 911-929 (1991) K. S. Subramanian et al "Leaching Of Antimony, Cadmium, Copper Lead, Silver, Tin and Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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