Lead-free, high tin, ternary solder alloy of tin, bismuth, and i

Details Lead-free, high tin, ternary solder alloy of tin, bismuth, and i Lead-free, high tin, ternary solder alloy of tin, bismuth, and i

1993-06-16

1994-09-06

Roy, Upendra

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420561, C22C 1300

Patent

active

053446070

ABSTRACT:
Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

REFERENCES:
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patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4806309 (1989-02-01), Tulman
patent: 4929423 (1990-05-01), Tucker et al.
Tschirner et al. Jour. Less Comm. Metals 24 (1971) 103.
Kabassis et al. Met. Trans. 15A (1984) 1515.
Journal Environmental Science, A26(6), 911-929 (1991).
K. S. Subramanian et al. "Leaching of Antimony, Cadmium, Copper Lead, Silver, Tin and Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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