High temperature, lead-free, tin based solder composition

Details High temperature, lead-free, tin based solder composition High temperature, lead-free, tin based solder composition

1993-06-16

1995-02-28

Andrews, Melvyn J.

Alloys or metallic compositions

Tin base

Copper containing

148400, 148405, C22C 1300

Patent

active

053934890

ABSTRACT:
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.

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Journal Environmental Science, A26(6), 911-929 (1991).
K. S. Subramanian et al "Leaching of Antimony, Cadmium, Copper Lead, Silver, Tin and Zinc From Copper Piping With Non-Lead-Based Soldered Joints".

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