4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Pretreatment of substrate or post-treatment of coated substrate

Qi-Zhong Hong

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active

Barrier-less plug structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Barrier/liner with a SiNx-enriched surface layer on MOCVD prepar

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent

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Combined dry and wet etch for improved silicide formation

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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Diffusion barrier trilayer for minimizing reaction between metal

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Integrated circuit interconnect and method

Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-318521

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