4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Phillip Duane Isaacs

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Apparatus and method to test for known good die

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Application of low temperature metallurgical paste to form a bon

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Application of low temperature metallurgical paste to form a bon

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent

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Column grid array or ball grid array pad on via

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Column grid array or ball grid array pad on via

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Profile ID: LFUS-PAI-P-175713

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