Metal fusion bonding – Process – Preplacing solid filler
Patent
1995-12-22
1998-09-15
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
22818022, 228119, 228191, H05K 334
Patent
active
058067531
ABSTRACT:
A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.
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Bielick James Daniel
Hoffmeyer Mark Kenneth
Isaacs Phillip Duane
Kidd Thomas Donald
Sluzewski David Allen
Heinrich Samuel M.
International Business Machines - Corporation
Ojanen Karuna
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