Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-01-13
1999-01-19
Wallace, Valencia
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257686, 257690, 257692, 257693, 257698, H05K 2302, H05K 100
Patent
active
058616632
ABSTRACT:
A electronic apparatus and a process for its manufacture are disclosed. The apparatus includes a planar card for accommodating an electronics module package having protruding solder columns and solder joints to mechanically mount and electrically connect the solder columns of the module to the planar card. The planar card includes a first side and a second side, a plurality of wiring lines forming a wiring pattern, and a plurality of vias extending at least partially through the card. Each of the vias includes at least one recessed area extending from one or both sides of the card. The recessed areas extending to a depth within the planar card sufficient to wick the solder joints, and the each of the recessed areas are shaped to provide surface tension to mechanically retain the solder joints.
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IBM Technical Disclosure Bulletin, "Subsurface Solder I C Module Pin", vol. 28, No. 6, pp. 2603-2604, Nov. 1985.
IBM Technical Disclosure Bulletin, Subsurface Solder I C Module Pin, vol. 28, No. 6 pp. 2603-2604, Nov., 1985.
"Flip Chip Attach with Solder Bump on Carrier Via Hole", IBM .RTM. Technical Disclosure Bulletin, vol. 37, No. 06B, Jun. 1994, pp. 159.
Isaacs Phillip Duane
Mathison Connie Jean
Swain Miles Frank
Hollingsworth Mark A.
International Business Machines - Corporation
Nasiedlak Tyler L.
Smith, Jr. Jerome R.
Wallace Valencia
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