Application of low temperature metallurgical paste to form a bon

Details Application of low temperature metallurgical paste to form a bon Application of low temperature metallurgical paste to form a bon

1997-04-25

1999-02-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

2282481, 228254, H05K 334

Patent

active

058735127

ABSTRACT:
A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

REFERENCES:
patent: 5001829 (1991-03-01), Schelhorn
patent: 5244143 (1993-09-01), Ference et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5410805 (1995-05-01), Pasch et al.
patent: 5695109 (1997-12-01), Chiang et al.
patent: 5762259 (1998-06-01), Hubacher et al.
Hwang, Jennie S., Ball Grid Array & Fine Pitch Peripheral Interconnections, Electrochemical Publications Ltd, pp. 21-24 (1995).
Lau, John H. (ed.) Handbook of Fine Pitch Surface Mount Technology, Van Nostrand Reinhold, pp. 161-232 (1994).

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