Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1998-07-07
2000-10-03
Hardy, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438 64, 438106, 438108, 257737, 257738, 257773, 257774, 257778, 257697, H01L 2144, H01L 2148, H01L 2150
Patent
active
061272043
ABSTRACT:
A electronic apparatus and a process for its manufacture are disclosed. The apparatus includes a planar card for accommodating an electronics module package having protruding solder columns and solder joints to mechanically mount and electrically connect the solder columns of the module to the planar card. The planar card includes a first side and a second side, a plurality of wiring lines forming a wiring pattern, and a plurality of vias extending at least partially through the card. Each of the vias includes at least one recessed area extending from one or both sides of the card. The recessed areas extending to a depth within the planar card sufficient to wick the solder joints, and the each of the recessed areas are shaped to provide surface tension to mechanically retain the solder joints.
REFERENCES:
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4787853 (1988-11-01), Igarashi
patent: 4866841 (1989-09-01), Hubbard
patent: 4914814 (1990-04-01), Behun et al.
patent: 4996391 (1991-02-01), Schmidt
patent: 5118027 (1992-06-01), Braun et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5386627 (1995-02-01), Booth et al.
patent: 5406701 (1995-04-01), Pepe et al.
patent: 5485039 (1996-01-01), Fujita et al.
patent: 5486723 (1996-01-01), Ma et al.
patent: 6011693 (2000-01-01), Gore
"Subsurface Solder I C Module Pin", IBM Technical Disclosure Bulletin, 28(6):2603-2604 (Nov. 1985).
"Flip Chip Attach with Solder Bump on Carrier Via Hole", IBM Technical Disclosure Bulletin, 37(06B):159 (Jun. 1994).
Lau, J.H., Ball Grid array Technology, McGraw-Hill Book Company, New York, N.Y., 1995, pp. 23-25.
Isaacs Phillip Duane
Mathison Connie Jean
Swain Miles Frank
Diaz José R.
Hardy David
International Business Machines - Corporation
Smith, Jr. Jerome R.
Truelson Roy W.
LandOfFree
Column grid array or ball grid array pad on via does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Column grid array or ball grid array pad on via, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Column grid array or ball grid array pad on via will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-194526