Apparatus and method to test for known good die

Details Apparatus and method to test for known good die Apparatus and method to test for known good die

1995-12-14

1998-08-04

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

438 15, G01R 3102

Patent

active

057899304

ABSTRACT:
The present invention may be characterized as an improved integrated circuit die testing system which includes a number of components which cooperate together. An integrated circuit carrier is provided for holding the integrated circuit die. Attached to the integrated circuit carrier is a chip site. Proximate to this chip site exists a plurality of contact pads. These contact pads are electrically coupled to a plurality of test points. Also provided is an integrated circuit die. Finally, a pattern of electrically conductive paste is provided. This electrically conductive paste electrically couples the integrated circuit die and the contact pads thereby allowing the integrated circuit die to be tested from the test points.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 5056706 (1991-10-01), Dolbear et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5336649 (1994-08-01), Kinsman et al.
patent: 5342206 (1994-08-01), Grabbe et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5414372 (1995-05-01), Levy
patent: 5494856 (1996-02-01), Beaumont et al.
IBM Technical Disclosure Bulletin, V. 37, No. 02B, Feb. 1994; "Improvements in the Sacrificial Substrate Burn-in Methodology for Known Good Die".
IBM Docket EN9-94-087; "Temporary KGD Contacting Device for Wireband Chips"(Dec. '94).
IBM Docket BU9-93-048; "Universal Substrate/Chip Fixture"(Dec. '93).
IBM Technical Disclosure Bulletin, V. 33, No. 1A, Jun. 1990; "High-Performance Test System".

Affiliated with

Also associated with

Rating

Apparatus and method to test for known good die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method to test for known good die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method to test for known good die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1181087