4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Peijun J. Chen

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Metal silicide induced lateral excessive encroachment...

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate

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Metal-germanium physical vapor deposition for semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate

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Metal-halogen physical vapor deposition for semiconductor...

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate

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Nickel alloy silicide including indium and a method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Nickel alloy silicide including indium and a method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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